| 发明名称 | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition | ||
| 摘要 | An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler. | ||
| 申请公布号 | US9462689(B2) | 申请公布日期 | 2016.10.04 |
| 申请号 | US201314647721 | 申请日期 | 2013.11.22 |
| 申请人 | LG INNOTEK CO., LTD. | 发明人 | Kil Geon Young;Kim Myeong Jeong;Park Jae Man;Yoon Jong Heum;Park Jeung Ook;Yun Sung Jin;Lee Jong Sik;Ju Sang A.;Yoon Yeo Eun |
| 分类号 | H05K1/05;B32B15/092;B32B27/20;B32B27/26;B32B27/38;C08L63/00;C08K3/22;C08K3/28;C08K3/34;C08K3/36;C08K3/38;H05K1/03;H01B3/40;C08G59/50;C08G59/22;C08G59/56;C09K5/14;C08K3/00;C08K5/41 | 主分类号 | H05K1/05 |
| 代理机构 | KED & Associates, LLP | 代理人 | KED & Associates, LLP |
| 主权项 | 1. An epoxy resin composition, comprising: an epoxy compound including an epoxy compound of the following Chemical Formula 1; a curing agent including diaminodiphenyl sulfone; andan inorganic filler: wherein each of R1 to R14 is selected from the group consisting of H, Cl, Br, F, an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms, and each of m and n is 2 or 3. | ||
| 地址 | Seoul KR | ||