SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To electrically connect leads to electrodes of a semiconductor device having an LOC structure on a chip through a multi-layer TAB tape. SOLUTION: A semiconductor device having a semiconductor element 3 and first-kind leads 1 for connecting a plurality of electrode pads 4 of the element 3 to the outside comprises a laminate having a plurality of conductive layers consisting of a wiring pattern or a planar conductor, a plurality of insulation layers for mutually insulating the conductive layers, layer interconnection lines for connecting different conductive layers of the plurality of conductive layers, and a plurality of second-kind leads led from the plurality of conductive lines. At least one of electrode pads 4 is connected to at least one of the first- class leads 1 through at least one of the layers and inter-layer interconnection lines and the plurality of second-kind leads. The laminate and the first-kind leads are disposed on the semiconductor element through an insulator.