| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a resin composition which is small in cure shrinkage when it is applied and cured, excellent in relaxing of an external stress, high in adhesion to a base material, and excellent in heat resistance by a method wherein the resin composition is composed of thermoplastic resin, rubber-elastic powder whose surface is chemically modified, and organic solvent. SOLUTION: A semiconductor device where a resin composition is used is obtained through a manner where resin composition is applied or pasted on a board or a lead frame, and then a chip is bonded to the board or the lead frame. For instance, resin composition is applied to the surface of a semiconductor part and then dried out into a protective film. The glass transition temperature of the protective film is 180 deg.C or above and high in heat resistance. At this point, the protective film is of elastic modulus 100 MPa to 1 GPa. The resin composition is obtained through a manner where thermoplastic resin is melted, and rubber-plastic powder whose surface is chemically modified is dispersed into the molten thermoplastic resin. After the resin composition is applied, solvent is evaporated from the resin composition, whereby a film can be formed, and a curing reaction hardly occurs when the film is dried out. As the thermoplastic resin has high affinity for the powder, paste can be kept high in thermoplastic resin and powder content, and the resin composition can be lessened in elastic modulus without deteriorating in adhesion and heat resistance.</p> |
