Semiconductor component e.g. an acceleration or pressure sensor chip

摘要

A semiconductor sensor chip (1) has an adhesively bonded protective resin layer (2), both the resin layer (2) and the adhesive (3) being resistant to the temperature at which wires are bonded to the chip pads. A semiconductor component comprises a chip (1) with a connection pad (1b) bonded to a wire (4), a front face protective resin layer (2) which covers the semiconductor structure of the chip (1) and which has an opening (20b) for pad exposure and wire passage, and a front face heat resistant adhesive (3) for bonding the resin layer (2) onto the sensor chip (1). The resin layer (2) and the adhesive (3) are resistant to the temperature at which the wire is bonded to the pad. Independent claims are also included for the following: (i) a similar component in which the resin layer (2) and the adhesive (3) are resistant to the temperature at which a resin encapsulation is molded over the chip and the protective resin layer or at which the chip is fixed to a housing; (ii) a semiconductor component production process comprising adhesively bonding a front face heat resistant resin layer onto a structured semiconductor wafer, forming resin layer openings for exposing connection pads on the wafer and bonding wires to the pads; and (iii) a semiconductor component production process comprising adhesively bonding a front face heat resistant resin layer onto a structured semiconductor wafer, dicing the wafer into chips and either molding resin over the individual chips or fixing each chip to a housing.