发明名称 IMPROVED SOLDER JOINT RELIABILITY
摘要 An interconnector (10) is provided that improves the reliability of an electrical and mechanical connection between two substrates (16, 18). An interconnector (10) according to the invention includes a compliant core (12) surrounded by an electrically conductive layer (14).
申请公布号 EP0970521(A1) 申请公布日期 2000.01.12
申请号 EP19970907926 申请日期 1997.02.27
申请人 OLIN CORPORATION 发明人 HOFFMAN, PAUL, R.
分类号 H01L23/12;H01L23/485;H01L23/498;H05K3/34 主分类号 H01L23/12
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