发明名称 HOT MELT MATERIAL, JOINT STRUCTURE AND DRY SUIT
摘要 PROBLEM TO BE SOLVED: To obtain a hot melt material, capable of providing an enough adhesive force even when a hot melt adhesive is heated and stuck at a comparatively low temperature, and further to provide a joint structure by using the hot melt material, and a dry suit having the joint structure. SOLUTION: This hot melt material 1 is obtained from a hot melt layer 5 and a low softening point resin layer 7. The hot melt layer 5 comprises a substrate layer 3 made of a polyvinyl chloride and a hot-melt adhesive and formed at the under side of the substrate layer 3. The low softening point resin layer 7 is formed under the hot melt layer 5. The low softening point resin layer 7 is properly selected from a urethane-based, an acrylic and an olefinic thermoplastic resins and the like. The softening point of the resin layer 7 is <120 deg.C. The thickness of the resin layer 7 is >=5 &mu;m but <=40 &mu;m.
申请公布号 JP2000063775(A) 申请公布日期 2000.02.29
申请号 JP19980238540 申请日期 1998.08.25
申请人 BANDO CHEM IND LTD 发明人 KAN KAZUHIKO
分类号 A41D13/00;A41D27/24;B32B27/30;B63C11/04;C09J7/02;C09J127/06;C09J131/04 主分类号 A41D13/00
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