发明名称 CHIP CARD WITH GLUED-IN MODULE AND METHOD OF ITS MANUFACTURING
摘要 <p>Contact chip card with glued-in module has supporting core (2) provided with seating opening (12), into which the case (11) of the chip (10) of the chip module (1) fits, while the chip module (1) is fixed to supporting core (2) by adhesive preparation (13), fixed between lower surface of the substrate (7) of the chip module (1) and upper surface of the supporting core (2). Adhesive preparation (13) consists of melt, glue or adhesive foil. Card is made so that supporting core (2) is provided with seating opening (12), possibly adhesive preparation (13) is applied, chip module (1) is seated and upper surface foil (3) and lower surface foil (4) are added, whereupon this constructional unit is laminated together and finally machined by common method.</p>
申请公布号 WO2000036558(A1) 申请公布日期 2000.06.22
申请号 CZ1998000052 申请日期 1998.12.11
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