发明名称 |
Method of encapsulating a wire bonded die |
摘要 |
A method of encapsulating a wire bonded die mounted on a carrier substrate, said carrier substrate and wire bonded die having a dam extending about said wire bonded die, comprising the steps of dispensing liquid encapsulant material in a predetermined pattern within an area bounded by said dam, said dam pattern including a plurality of discrete, single-point dispensing locations and allowing said liquid encapsulant material to spread out and form an encapsulating layer over said wire bonded die. <IMAGE> |
申请公布号 |
EP0924756(A3) |
申请公布日期 |
2000.06.28 |
申请号 |
EP19980122882 |
申请日期 |
1998.12.02 |
申请人 |
NORDSON CORPORATION |
发明人 |
FALCONE, FRANK;LEVIS, ALAN;NEWBOLD, JOHN |
分类号 |
H01L23/28;H01L21/56;H01L23/24 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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