| 摘要 |
PURPOSE: A plastic package is provided to simplify a structure of the plastic package and to improve a manufacturing process, by supporting and protecting a die with adhesive tape, and by making an electrical connection. CONSTITUTION: A plastic package comprises a die(10), at least one tape(12), and encapsulating resin(22). The die includes a predetermined integrated circuit and a plurality of bonding pad(14) established in a predetermined position. The tape adhered to the die, has a metal line(18) for electrically connecting the die with the exterior while having one-to-one correspondence to the bonding pad, The encapsulating resin has a predetermined shape while molding the die and tape.
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