发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of remarkably enhancing the photosensitivity and resolution and capable of obtaining a hardened film superior in resistance to nonelectrolytic gold plating. SOLUTION: This photosensitive resin composition contains (A) a modified copolymer obtained by adding an epoxy group of an alicyclic unsaturated compound to a part of the acid groups of a copolymer consisting of (a) β- carboxyethyl acrylate, (b) an unsaturated compound having an acid group, and (c) methacrylate. (B) at least one of monomers selected from the group comprising acetoacetoxyethyl acrylate, acryloylmorpholine, and tetrahydrofurfuryl acrylate, or a modified copolymer obtained by adding an epoxy group of an alicyclic unsaturated compound to a part of the acid groups of a copolymer comprising the above monomers (a), (b), and (c), and the ones of (B), and further, (C) a diluent and (D) a photopolymerization initiator.
申请公布号 JP2000292923(A) 申请公布日期 2000.10.20
申请号 JP19990097475 申请日期 1999.04.05
申请人 TAIYO INK MFG LTD 发明人 DAIKO YOSHIKAZU
分类号 H05K3/28;C08F2/50;C08F290/12;C08K3/00;C08K5/00;C08L63/00;G03F7/004;G03F7/027;G03F7/028;G03F7/038;G03F7/085;H05K3/06;H05K3/46 主分类号 H05K3/28
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