| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate for mounting of an electronic component which can secure sufficient sealing width on an upper surface of an upper insulating layer, can avoid generation of crackings in the upper insulating layer and can exhibit superior airtightness reliability. SOLUTION: The substrate for mounting of an electronic component E includes a lower insulating layer 1, having a mounting part 1a of the electronic component E and formed thereon with a plurality of metallized conductor layers 4 for external connection with the electrodes of the electronic component and an upper insulating layer 2 of a frame shape laminated on the lower insulating layer 1 and formed thereon with a sealing metallized layer 5 for joining a lid member thereon. The upper insulating layer 1 is formed in its inner and/or peripheral surface with a notch 6, and a metallized conductor column 7 for electrical connection between the metallized layers 4 and 5 is buried in the notch 6 so that an upper end face of the column becomes flush with the upper face of the upper layer 2. Thereby there can be provided a substrate for mounting of the electronic component which can secure sufficient sealing width, effectively prevent generation of crackings in the upper layer 2, and exhibit high reliability in airtightness.</p> |
