| 摘要 |
PROBLEM TO BE SOLVED: To reduce cost while decreasing the surface area by integrally incorporating an integrated circuit part for varying the field strength in the vicinity of a through hole surrounded by individual electrodes and connecting the output from the integrated circuit part with the individual electrodes through a lead part. SOLUTION: An integrated circuit part 50 is formed as a pattern circuit similarly to individual electrodes 36 and a lead part 54. An output pulse from the integrated circuit part 50 for varying the field strength in the vicinity of a through hole 34 surrounded by individual electrodes 36 is applied to the individual electrodes 36 through the lead part 54. According to the arrangement, unnecessary parts are reduced and the overall size can be reduced. Since the integrated circuit part 50 is formed integrally and simultaneously with the individual electrodes 36 and the lead part 54, no connecting work, e.g. wire bonding work, is required resulting in cost reduction. |
