Hybrid component manufacture/encapsulation technique having component connected substrates and flexible circuit wire connections/pad connection with semi solid sticky blob substrate placed forming partial encapsulation.

摘要

The hybrid component manufacture technique has a substrate (5) base plate (2) mounted and with electrical components (6). A flexible printed circuit (3) has contact wires to contact pads on the substrate. Partial encapsulation is carried out by placing a blob (15) of semi solid material which sticks to the substrate base and deadens component and wire contact vibrations.