| 摘要 |
<p>PURPOSE:To connect a board to a chip with high reliability by sinking filler and connecting in a state that the filler is uniformly spread all over the board. CONSTITUTION:A board 11 is coated with conductive adhesive 13 enclosing conductive filler 12, and heated to form a sunk layer A of the filler 12 on the board 11. Then, a chip 16 is so aligned that electrodes 15 of the chip 16 are respectively opposed to electrodes 14 of the board 11. The chip 16 is pressurized to destroy a shell part of the filler 12 to expose inner conductive fine particles. Then, the board 11 is heated to be connected to the chip 16. Thus, the filler 12 can exist under the bumps 15, and a connection with high reliability can be conducted even in the case of a small amount of the filler.</p> |
