| 摘要 |
Provided are: an electronic circuit board having reduced sizes by improving the mounting density of electronic components; a laminated board; and a method for manufacturing the electronic circuit board. An electronic circuit board 100 of the present invention is characterized by being provided with: a plurality of electronic components 40a-40d; and a board-like silicon substrate 20, which has a wiring pattern that is formed on the front surface and/or rear surface, and recessed sections 21a-21d in which the electronic components 40a-40d are separately mounted. The electronic circuit board is also characterized in that: the side surfaces of the recessed sections 21a-21d are perpendicular to the front surface of the silicon substrate 20; and the wiring pattern is connected to the electronic components 40a-40d via vias 31a-31d and/or bottom surface electrodes formed in the recessed sections 21a-21d, said electronic components being mounted in the recessed sections 21a-21d. |
