| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that an obtained electronic device can not be securely mounted on an external electric circuit board and that sealing of electronic components is complicated. SOLUTION: A mother board 10, which is constituted by laminating upper and lower insulating layers 10a and 10b, has a plurality of wiring board areas 11 located and formed at a central part being partitioned by dividing lines 12, is provided with a hole 13 for notch on each of dividing lines 12 and is provided with a wiring conductor 5 derived from the upper surface of each wiring board area 11 through the inside and the inner wall of the hole 13 for notch to the lower surface, is prepared. Next, electronic components 2 are mounted on the upper surfaces of the respective wiring board areas 11 and respective electrodes thereof are connected to the wiring conductor 5. Next, a resin sealing member 3 is applied in the state of liquid and hardened so as to cover the respective wiring board areas 11 and the respective electronic components 2 and finally, the mother board 10 and the resin sealing member 3 are divided along the dividing line 12. Concerning such a producing method for electronic device, when applying the resin sealing member 3 in the state of liquid, that member does not flow into the hole 13 for notch, where the wiring conductor 5 is attached. |
