发明名称 Method and device for mounting component
摘要 A method for mounting components using mounting heads for which a plurality of suction or mounting operating positions are set for suction nozzles in a state where the mounting head is at rest in a component supply position or component mounting position, it being possible to select any of these operating positions, comprising a first step of selecting a component supply position or component mounting position such that the amount of movement of component feeder holding components to be mounted, or the amount of movement of the substrate to the mounting position for the next component to be mounted becomes a minimum, and moving the component feeder or substrate accordingly; and a second step of selecting a suction nozzle position corresponding to the component suction position or component mounting position in the first step, whilst the mounting head is moving towards the component suction position.
申请公布号 US2001003865(A1) 申请公布日期 2001.06.21
申请号 US20010769788 申请日期 2001.01.25
申请人 HATA KANJI;OJI SHIRO;NEGISHI SHIGETOSHI;SENO MAKITO 发明人 HATA KANJI;OJI SHIRO;NEGISHI SHIGETOSHI;SENO MAKITO
分类号 B23P19/00;B23P21/00;B25J15/06;H05K13/04;(IPC1-7):B23P19/00;H05K3/30 主分类号 B23P19/00
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