| 摘要 |
<p>PROBLEM TO BE SOLVED: To shorten the distance between electric components by mounting the electric components inside a printed board and to reduce inductance in an electric characteristic by shortening the length of a conductive pattern. SOLUTION: A bypass capacitor 3 is buried and mounted in a recessed part formed by grooving one surface 2a of the printed board 2. Subsequently, an IC socket 1 is mounted on the surface 2a of the printed board 2. Then, a conductive pattern 4a is formed to electrically connect the IC socket 1 to the metal parts 3a formed on both sides of the bypass capacitor 3.</p> |
