发明名称 HIGH SENSITIVITY PHOTORESIST COMPOSITION CONTAINING SOLUBLE FILM FORMING DENDRIMER AND PATTERN FORMING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a high sensitivity and high resolution photoresist composition developable with an organic solvent for use in E(electron) beam lithography. SOLUTION: The composition includes a high sensitivity soluble film forming photoresist composition of a dendrimer calix [4] arene derivative of formula (1) and forms a lithographic pattern together with a crosslinker selected from glycoluril derivatives capable of reacting with such dendrimers under the action of an acid catalyst, a photo-acid generating agent and an organic solvent. The composition is particularly useful for forming a high resolution (<100 nm) negative type image.
申请公布号 JP2002049152(A) 申请公布日期 2002.02.15
申请号 JP20010164184 申请日期 2001.05.31
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 AFZALI-ARKDAKANI ALI;TORISHIA LIN BREEN;GELORME JEFFREY D;DAVID BRIAN MITSUI;MICHAEL JOSEPH LUX
分类号 G03F7/038;H01L21/027 主分类号 G03F7/038
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