发明名称 |
HIGH SENSITIVITY PHOTORESIST COMPOSITION CONTAINING SOLUBLE FILM FORMING DENDRIMER AND PATTERN FORMING METHOD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a high sensitivity and high resolution photoresist composition developable with an organic solvent for use in E(electron) beam lithography. SOLUTION: The composition includes a high sensitivity soluble film forming photoresist composition of a dendrimer calix [4] arene derivative of formula (1) and forms a lithographic pattern together with a crosslinker selected from glycoluril derivatives capable of reacting with such dendrimers under the action of an acid catalyst, a photo-acid generating agent and an organic solvent. The composition is particularly useful for forming a high resolution (<100 nm) negative type image. |
申请公布号 |
JP2002049152(A) |
申请公布日期 |
2002.02.15 |
申请号 |
JP20010164184 |
申请日期 |
2001.05.31 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
AFZALI-ARKDAKANI ALI;TORISHIA LIN BREEN;GELORME JEFFREY D;DAVID BRIAN MITSUI;MICHAEL JOSEPH LUX |
分类号 |
G03F7/038;H01L21/027 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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