发明名称 |
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD |
摘要 |
A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed. <IMAGE> |
申请公布号 |
EP1194022(A1) |
申请公布日期 |
2002.04.03 |
申请号 |
EP20000931571 |
申请日期 |
2000.05.25 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
ASAI, MOTOO;WANG, DONGDONG;MORI, TAKAHIRO |
分类号 |
H01L21/48;H01L23/498;H05K1/03;H05K3/00;H05K3/10;H05K3/18;H05K3/38;H05K3/42;H05K3/46 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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