SEMICONDUCTOR DEVICE PACKAGING ASSEMBLY AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor device packaging assembly and a method for fabricating the same are provided to improve productivity by simplifying a semiconductor device packaging process. CONSTITUTION: A semiconductor chip having a main surface includes one or more element region and one bonding region(101). A bottom frame unit includes a bottom support portion(301) and a bottom frame portion(302). The bottom support portion(301) is adhered on an opposite surface to the main surface of the semiconductor chip in order to support the semiconductor chip. A bridge frame unit includes a bridge frame portion(202) and a plurality of conductive bars. The bridge frame portion(202) is boned with the bottom frame portion(302) of the bottom frame unit. The plural conductive bars(200) are electrically connected with corresponding boding regions of the semiconductor chip. A plurality of sprocket holes(303) are used for coupling the bottom frame unit with the bridge frame unit.