SOLDER BALL BUMPING METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A solder ball bumping method for manufacturing semiconductor package is provided to decrease a manufacturing cost by reducing a needless waste of a solder ball and a flux. CONSTITUTION: Solder ball bumping tools(4) are electrically and respectively connected with a controller(2) for selectively picking up and bumping solder balls(3) by a unit(1a) about a strip-type of a PCB(Printed Circuit Board)(1). A bad unit among all the units(1a) of the PCB(1) is checked by a vision. By supplying a bad unit signal to the controller(2) through the vision, bumping solder balls(3) are not picked up by the solder ball bumping tool(4) about only the bad unit. At this point, the bad unit is selectively removed to improve a yield and a manufacturing cost.