| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device, without breakage of a metal thin wire by cracks and without the malfunction of a signal processing IC. SOLUTION: Lead frames 2 and 3 are inserted to the inside of a frame-like casing 1 made of heat resistant resin, a photodetector 4 is loaded as a functional element on the surface of the lead frame, and the signal processing IC 5 for processing and outputting signals from the photodetector 4 is loaded on the back surface of the lead frame 3. The photodetector 4 is sealed with optically transparent epoxy resin 6, and the signal processing IC 5 is sealed with epoxy resin 7 containing filler. |
