LEAD FRAME AND METHOD FOR MANUFACTURING RESIN MOLDING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve quality of a resin molding semiconductor device by reducing burr generated on a cutting surface of a lead frame, and improve productivity by lengthening the working life of a cutting blade. SOLUTION: The lead frame 10 is provided with chip mounting parts 12 which are retained by an outer yoke 11 and mount a plurality of semiconductor chips, inner leads 13 arranged around each of the chip mounting parts 12, and interconnections 14 which interconnect and retain the inner leads 13 and the outer yoke 11. A plurality of the chip mounting part 12 are surrounded by a sealing region 20 which is collectively sealed with resin material for sealing. First apertures 16 whose width is lager than that of the cutting blade are arranged in regions which are outside the sealing regions 20 in the outer yoke 11 of the lead frame 10 and on prolongation lines of the interconnections 14.