MOLD DIE FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A mold die for manufacturing a semiconductor package is provided to improve a step coverage between a PCB(Printed Circuit Board) and a center block by improving the structure. CONSTITUTION: A mold die for manufacturing a semiconductor package comprises an upper frame(1), a center block installed under the upper frame(1) to confront the upper frame(1) and a lower frame(2) installed on both sides of the center block to confront the upper frame(1). The mold die for manufacturing a semiconductor package further includes a lower center block(3b) fixedly installed between the center block and the lower frame(2), an upper center block(3a) and a lifting part.