发明名称 Semiconductor device and method of manufacturing the same
摘要 A NAND type semiconductor device is disclosed, in which a first insulating film embedded between the memory cell gates and between the memory cell gates and the selecting gate does not contain nitrogen as a major component, a second insulating film is formed on the first insulating film, and an interlayer insulating film is formed on the second insulating film whose major component is different from a major component of the second insulating film.
申请公布号 US2002130355(A1) 申请公布日期 2002.09.19
申请号 US20020098130 申请日期 2002.03.15
申请人 TAKEUCHI YUJI;ICHIGE MASAYUKI;GODA AKIRA 发明人 TAKEUCHI YUJI;ICHIGE MASAYUKI;GODA AKIRA
分类号 H01L21/283;H01L21/768;H01L21/8247;H01L23/522;H01L27/10;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L29/788 主分类号 H01L21/283
代理机构 代理人
主权项
地址