| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the mounting area of electronic components consisting of chip parts, etc. such as capacitor, chip resistor, etc., and reinforce the junction strength, and facilitate the external appearance inspection of junction state and the repair work. SOLUTION: Since a connector terminal 23 provided at the bottom of an electronic part 21 is jointed by solder 27 to the connector terminal 26 of a circuit board 25, the mounting area of the electronic component 21 can be made small. Moreover, since a part of the solder 26 is filled in the groove 24 provided at the flank of the electronic part 21 by the capillary phenomenon, the junction strength can be strengthened. Moreover, since the filling state of the solder 27 into the groove 24 of the electric component 21 can be inspected for external appearance from above that groove 24, the inspection of the external appearance of the junction state is facilitated. Furthermore, since repair work can be performed, using a heating jig capable of penetration from its side face into the groove 24 of the electronic component 21, the repair work is facilitated.</p> |
