| 摘要 |
<p>PROBLEM TO BE SOLVED: To print solder paste and mount electronic parts at one time without decreasing heat radiation characteristics, and increase the density of mounted parts. SOLUTION: A first conductive pattern 44 and a second conductive pattern 45 are provided in two layers at positions to form a two-layer pattern 46, thereby attaining high density of electronic parts 61. Further, as the surfaces of the second conductive pattern 45 and a metal bus bar 53 working as connectors of the electronic parts 61 are formed on the same level, it is possible to print solder paste and mount the electronic parts 61 on a metal board 40 at one time. Further, a large current can be simply caused to flow by utilizing the metal bus bar 53 without being compelled to make pattern designs corresponding to the large current.</p> |
