| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive laminate which has high resolution and pattern shapes faithful to a mask film, lessens the generation of air voids when a DFR is laminated on a substrate, makes a photosensitive resin layer easily tightly adherable to a protective layer in manufacturing the photosensitive resin laminate by laminating the protective layer on the photosensitive resin layer and hardly produces the left-over of peeling in a resist pattern peeling process step after electroplating when the laminate is applied particularly to a semi-additive method. SOLUTION: The film thickness of a base of the photosensitive resin laminate consisting of the base, the photosensitive resin layer and the protective layer is specified to >=10 to <=30 μm, the haze thereof to >=0.1 to <=1.5%, the film thickness of the protective layer to >=30 to <=50 μm and the arithmetic mean deviation of profile (Ra) thereof <0.1 μm.
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