HEAT DISSIPATION SUBSTRATE AND MANUFACTURING METHOD FOR SAME

摘要

A heat dissipation substrate is provided with a substrate main body comprising an insulating layer and a conducting layer, a through-hole (5) extending through the substrate main body, a thermally conductive body (7) comprising thermally conductive material and housed within the through-hole (5), a gap portion (8) which exists as an interval between the through-hole (5) and the thermally conductive body (7), and a fixed plated portion formed by way of a plating process in the gap portion (8) in order to secure the thermally conductive body (7) to the through-hole (5). For the gap portion (8), an interval between the outer peripheral surface of the thermally conductive body (7) and the inner wall surface of the through-hole (5) facing the same is formed as non-uniform and has minimum portions (24) which are of a minimum interval and maximum portions (23) which are of a maximum interval.