发明名称 |
MANUFACTURING METHOD FOR SURFACE ACOUSTIC WAVE ELEMENT |
摘要 |
<p>PROBLEM TO BE SOLVED: To efficiently assign interdigital electrodes of surface acoustic wave elements to a piezoelectric substrate. SOLUTION: In the exposure to assign interdigital electrodes of the surface acoustic wave elements to the piezoelectric substrate, the rhombic interdigital electrodes are assigned to the piezoelectric substrate and exposed in a way that rhombic sides of the rhombic interdigital electrodes are adjacent to each other among adjacent chips.</p> |
申请公布号 |
JP2002353762(A) |
申请公布日期 |
2002.12.06 |
申请号 |
JP20010153595 |
申请日期 |
2001.05.23 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
MIYAGAWA CHIAKI |
分类号 |
H01L41/22;H01L41/29;H01L41/338;H03H3/08;H03H9/145;H03H9/25 |
主分类号 |
H01L41/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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