| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a hermetically sealed IN package with enhanced productivity and reduced manufacturing cost. SOLUTION: A large number of chips are mounted in a substrate and after the internal electrode wiring of the substrate is connected to the electrodes of the IC chip through wires, epoxy resin is applied around the IC chip using a dispenser and the IC chip is surrounded by the frame of epoxy resin before being bonded with a planar lid. Finally, the substrate is cut at an intermediate position of the epoxy resin thus producing individual IC packages. |
