| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lamination apparatus which can form a sharp temperature gradient in the thickness direction of a laminate and a method for laminating thermoplastic printed boards which does not cause the dimensional change of the boards and the deformation of a wiring pattern when the boards are laminated. SOLUTION: In the lamination apparatus 1 installed in a vacuum chamber 2, the thermoplastic printed boards 51 and 52 of syndiotactic polystyrene (SPS) are held between a lower holding block 11 comprising an infrared transmissible cooling holder 12 in which cooling water 18 flows between upper and lower silica glass plates 17 and an infrared lamp 14 located outside the holder 12 and a similar upper holding block 21, heated, and pressed to be fusion-bonded and laminated. In this process, the lamination surfaces M are heated at a temperature equal to or above the melting point of the SPS, the contact surfaces C with the cooling holders 12 and 22 are kept at a temperature not exceeding the second order transition point of the SPS, and the holding distance G, set at a prescribed value, is kept constant.</p> |
