THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME AND SUSPENSIONLIKE MIXTURE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having improved impact characteristics, thermal cracking, oxidative deterioration and heat deterioration resistances without deteriorating heat resistance and suitable for sealing a semiconductor, etc. SOLUTION: This thermosetting resin composition is obtained by curing a composition comprising a thermosetting resin and a reactive monoolefin polymer. The main phase structure thereof is a sea-island structure composed of a cured product comprising a composition containing the thermosetting resin or further a curing agent as a continuous phase and a dispersed phase consisting essentially of the reactive monoolefin polymer. The structure of the dispersed phase has a plurality of finer dispersed phases in the interior thereof and/or at least one interfacial layer present in the whole region of the outer peripheral part of the dispersed phase.