| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve a problem that a peel occurs between a wiring layer and a copper plated layer and blister occurs to the copper plated layer. SOLUTION: A wiring substrate is adhered by a wiring layer 2 to which the electrode of an electronic part 3 is connected through a connection member 5 formed of a low melt point brazing filler metal. A copper-boron plated layer 6, a copper plated layer 7, an alloy layer 8 of at least one kind of palladium, platinum, rhodium and ruthenium and phosphorus, and a gold plated layer 9 are adhered, in the order, to the surface of a region with which the electrode of at least the electronic part 3 of the wiring layer 2 is joined through the connection member 5.</p> |
