发明名称 LASER BEAM MACHINING METHOD AND DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and device having the ability to machine only the thin film of the upper layer among laminated thin films selectively into a desired shape by laser beam machining. <P>SOLUTION: In this method, a laser beam is emitted in a prescribed pattern to a second thin film 20 of a workpiece 210 having a first thin film 15 and the second thin film 20 which is laminated on the surface of the first thin film 15 and formed with a material different from that of the first. With the workpiece 210 cooled on a cooled stage 208, a laser beam is emitted to the second thin film 20, only the second thin film 20 is machined in a specific shape. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003251485(A) 申请公布日期 2003.09.09
申请号 JP20020058737 申请日期 2002.03.05
申请人 SONY CORP 发明人 MURASE EIJU;SASAKI YOSHINARI;ASO YUKINARI;YOSHIDA KAZUHIKO;KIYOI KIYOMI
分类号 G02F1/13;B23K26/06;B23K101/36;G02F1/1343;(IPC1-7):B23K26/06;G02F1/134 主分类号 G02F1/13
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