| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that a conductive tape is displaced due to the hardening condition of a bonding material when the conductive bonding material having viscosity is used for electrical connection between an electronic component body and a lead using the conductive tape. <P>SOLUTION: In an electronic component 3, both end portions of the conductive tape 11 are laminated at the respective upper portions of electrode of electronic component 3 and lead 2b, and the laminated portions are electrically connected via conductive bonding materials 15, 16. The conductive bonding materials 15, 16 are formed using resin system bonding materials having different hardening characteristics in the side of the electronic component body 3 and in the side of the lead 2b. <P>COPYRIGHT: (C)2004,JPO</p> |
