发明名称 HIGH SPEED INTERCONNECT CIRCUIT TEST METHOD AND APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem occurring when a high speed interconnect circuit is tested by a test method of DC and AC coupled interconnect circuit based on conventional IEEE1149.1TAP and JTAG and to provide a method and an apparatus for enabling to perform high speed test of an interconnect circuit including a JTAG boundary scan cell while minimizing the additional circuit. <P>SOLUTION: A Propagation Test instruction, a Decay Test instruction and a Cycle Test instruction are added to the interconnect circuit test method of a circuit including a conventional JTAG boundary scan cell. These additional instructions extends conventional JTAG operation and enables the test of the high speed interconnect circuit. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003344508(A) 申请公布日期 2003.12.03
申请号 JP20030072799 申请日期 2003.02.10
申请人 TEXAS INSTRUMENTS INC 发明人 WHETSEL LEE D
分类号 G01R31/28;G01R31/3185;G06F11/22 主分类号 G01R31/28
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