发明名称 Optical interconnection circuit board and manufacturing method thereof
摘要 In an optical connection board, a first clad layer is formed on a flat surface of a substrate and a core layer is formed on the first clad layer and is extended in a propagation direction of an optical signal. The core layer is covered with a second clad layer. A termination mirror having a reflection face is so buried in the clad layer as to reflect the optical signal guided in the core layer, to the outside of the optical connection board.
申请公布号 US6741781(B2) 申请公布日期 2004.05.25
申请号 US20010961372 申请日期 2001.09.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 FURUYAMA HIDETO
分类号 G02B6/122;G02B6/12;G02B6/125;G02B6/13;G02B6/42;G02B6/43;H01S5/00;H01S5/20;(IPC1-7):G02B6/10 主分类号 G02B6/122
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