发明名称 |
SUBSTRATE HANDLING DEVICE FOR REDUCING A FABRICATION COST |
摘要 |
PURPOSE: A substrate handling device is provided to support a substrate with a small number of line materials and sealing materials without forming plural holes in a plate member. CONSTITUTION: Supporting balls(50) connected by line materials(54) are disposed on a surface of a hot plate. Pins(55) for attaching the line materials(54) are installed on sides(45a,45b) of the hot plate. Hooking portions(54a) are formed on both ends of the line materials(54) to be attached to the hot plate. The line materials(54) are attached to the hot plate, depending on whether the hooking portions(54a) are hooked over the pins(55) of the hot plate.
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申请公布号 |
KR20040047616(A) |
申请公布日期 |
2004.06.05 |
申请号 |
KR20030083533 |
申请日期 |
2003.11.24 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
SAKAI MITSUHIRO;IKEDA KATSUHIRO |
分类号 |
G02F1/13;H01L21/00;(IPC1-7):G02F1/13 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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