发明名称 Image forming apparatus, chip, and chip package to reduce cross-talk between signals
摘要 An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second pad to transmit a second type of signal, and a third pad interposed between the first and second pads, to reduce cross-talk between the first and second types of signals.
申请公布号 US9484295(B2) 申请公布日期 2016.11.01
申请号 US201414513720 申请日期 2014.10.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Park Seung-hun;Hong Eun-ju
分类号 H01L23/52;H01L23/50;H01L27/146;H01L23/00;H01L25/16;H01L23/498 主分类号 H01L23/52
代理机构 Staas & Halsey LLP 代理人 Staas & Halsey LLP
主权项 1. A chip package comprising, a substrate, and a chip mounted on the substrate, comprising: first pads consecutively arranged with respect to each other and disposed on the chip and different pads of the first pads are configured to transmit different first signals which are either data signals or control signals;a second pad disposed on the chip and configured to transmit second signals which are address signals; anda first ground pad disposed on the chip between the first pads and the second pad, the first ground pad configured to reduce cross-talk between the first signals and the second signals,wherein the first pads, the first ground pad, and the second pad are consecutively arranged on the chip.
地址 Suwon-Si KR