| 摘要 |
FIELD: electronic instrumentation engineering. ^ SUBSTANCE: proposed printed-circuit board characterized in unified mechanical design and manufactured to unified documentation using unified process and equipment thereof is essentially planar substrate having at least one seating place for separately packaged plug-in electronic component such as integrated-circuit of definite size provided on at least one end with terminal contacts arranged in line. Line of conducting strips whose quantity depends on number of terminal contacts are formed on planar substrate in vicinity of seating place to secure respective terminal contacts on them, each strip being connected to printed conductors for connection to other electronic components disposed on wafer surface in compliance with schematic circuit diagram. Line of additional printed conducting strips is formed on planar substrate in parallel with line of printed conducting strips used to secure output terminals of plug-in electronic components for surface wiring and securing terminal contacts of other separately packaged plug-in electronic component of integrated-circuit type whose size is other than that of mentioned electronic component. Printed conducting strips of both plug-in electronic components of same circuit arrangement are interconnected on this substrate. Printed conducting strips of other plug-in electronic component whose circuit arrangement is other than that of mentioned plug-in components and printed conducting strips of other electronic plug-in component have their terminal contacts brought out through substrate to its other side, and at least some of printed conductors designed for connecting mentioned terminal contacts in compliance with their connection diagram are formed on additional planar substrate contacting through its rear side the planar substrate carrying electronic component. ^ EFFECT: enlarged functional capabilities of printed-circuit boards designed for operation under versatile conditions. ^ 2 cl, 5 dwg |
