发明名称 APPARATUS AND METHOD OF SURFACE TREATMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a device and method for a surface treatment capable of improving a surface treatment rate by promoting an additional reaction of the surface after a surface of a processed body is treated in a plasma discharge area. <P>SOLUTION: This device for surface treatment is provided with a second dielectric member 42 having a gas passage 60 between a first dielectric member 41, and a third dielectric member 43 wherein a discharging gap is formed between an applying side electrode part 20 and an earth side electrode part 30, and for processing the surface 71 by exposing the surface 71 of the processed body 70 to excitation active species of the gas plasma discharged between the applying side electrode part 20 and the earth side electrode parts 30 under atmospheric pressure or a pressure near the atmospheric pressure and provided through a gas passage 60 plasma. The third dielectric member 43 is extended from the applying side electrode part 20 to a downstream side of a moving direction of the earth side electrode part 30 apart from the earth side electrode part 30. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004253282(A) 申请公布日期 2004.09.09
申请号 JP20030043245 申请日期 2003.02.20
申请人 SEIKO EPSON CORP 发明人 SUZUKI TAKAYUKI
分类号 H05H1/24;B01J19/08;C23F4/00;H01L21/3065;H01L21/31 主分类号 H05H1/24
代理机构 代理人
主权项
地址