发明名称 METHOD OF FORMING OHMIC ELECTRODE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming an ohmic electrode whose contact specific resistance is small and thermostability is high, capable of stably operating a device over a long period. <P>SOLUTION: A contact layer 2, comprising a p-type compound semiconductor containing at least one kind of element out of a group comprising gallium, aluminum, boron and indium as the group-III elements and nitrogen, is formed on a p-type compound semiconductor 1. A transition element layer 3a, containing at least one kind of element from among the transition elements other than gold and platinum, is formed on the contact layer 2; a platinum layer 3b comprising platinum is formed on the layer 3a; and after a gold layer 3c comprising gold is further formed on the platinum layer 3b, the layers are annealed as a whole. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004312038(A) 申请公布日期 2004.11.04
申请号 JP20040190824 申请日期 2004.06.29
申请人 SONY CORP 发明人 MIYAJIMA TAKAO
分类号 H01L21/28;H01L21/338;H01L29/812;H01L33/32;H01L33/40 主分类号 H01L21/28
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