发明名称 |
RRAM MEMORY CELL ELECTRODES |
摘要 |
<p>A RRAM memory cell is formed on a silicon substrate (12) having a operative junction therein and a metal plug (16) formed thereon, includes a first oxidation resistive layer (20); a first refractory metal layer (22); a CMR layer (24); a second refractory metal layer (26); and a second oxidation resistive layer (28). A method of fabricating a multi-layer electrode RRAM memory cell includes preparing a silicon substrate; forming a junction in the substrate taken from the group of junctions consisting of N+ junctions and P+ junctions; depositing a metal plug on the junction; depositing a first oxidation resistant layer on the metal plug; depositing a first refractory metal layer on the first oxidation resistant layer; depositing a CMR layer on the first refractory metal layer; depositing a second refractory metal layer on the CMR layer; depositing a second oxidation resistant layer on the second refractory metal layer; and completing the RRAM memory cell.</p> |
申请公布号 |
KR20050055582(A) |
申请公布日期 |
2005.06.13 |
申请号 |
KR20040095147 |
申请日期 |
2004.11.19 |
申请人 |
SHARP CORPORATION |
发明人 |
ZHANG FENGYAN;ZHUANG WEI WEI;HSU SHENGTENG;PAN WEI;LI TINGKAI |
分类号 |
H01L21/28;G11C13/00;G11C16/02;H01L21/8246;H01L27/105;H01L27/108;H01L27/115;H01L27/22;H01L29/68;H01L39/00;H01L43/08;H01L45/00;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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