Heat treatment apparatus, calibration method for temperature measuring system of the apparatus, and heat treatment system

摘要

A heat treatment apparatus has a controller ( 100 ) provided with a temperature estimator ( 110 ) for estimating a temperature of a wafer by detection signals of temperature sensors (Sin, Sout) and a temperature calibrator ( 120 ) for correcting the estimated temperature of the wafer. In order to calibrate the temperature, an offset value stored in an offset table ( 122 ) is used. The offset value is determined based on the relationship between film-thickness of films formed in an experimental heat treatment process and process temperatures.