发明名称 SURFACE PROCESSING DEVICE AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To efficiently perform surface processing on a workpiece of large area even though hole rows are short in a surface processing device that sprays a processing gas onto the surface of the workpiece from the hole rows of slits or the like. <P>SOLUTION: A plurality of electrode plates 11, 12 are juxtaposed at the processing section 1 of a plasma surface processing device M. Slit-like hole rows 10a are formed between the adjacent electrode plates, and a hole-row group 100 is configured by a plurality of the juxtaposed hole rows 10a. The workpiece W is moved along the extending directions of each slit 10a by a movement mechanism 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005333096(A) 申请公布日期 2005.12.02
申请号 JP20040186435 申请日期 2004.06.24
申请人 SEKISUI CHEM CO LTD 发明人 ANZAI JUNICHIRO;NAKANO YOSHINORI;KAWASAKI SHINICHI;NAKATAKE SUMIO;MAYUMI SATOSHI;MIYAMOTO EIJI;TAKEUCHI TOSHIKIMI
分类号 H05H1/24;C23C16/455;H01L21/205;H01L21/304;H01L21/3065 主分类号 H05H1/24
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