发明名称 |
SURFACE PROCESSING DEVICE AND METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently perform surface processing on a workpiece of large area even though hole rows are short in a surface processing device that sprays a processing gas onto the surface of the workpiece from the hole rows of slits or the like. <P>SOLUTION: A plurality of electrode plates 11, 12 are juxtaposed at the processing section 1 of a plasma surface processing device M. Slit-like hole rows 10a are formed between the adjacent electrode plates, and a hole-row group 100 is configured by a plurality of the juxtaposed hole rows 10a. The workpiece W is moved along the extending directions of each slit 10a by a movement mechanism 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005333096(A) |
申请公布日期 |
2005.12.02 |
申请号 |
JP20040186435 |
申请日期 |
2004.06.24 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
ANZAI JUNICHIRO;NAKANO YOSHINORI;KAWASAKI SHINICHI;NAKATAKE SUMIO;MAYUMI SATOSHI;MIYAMOTO EIJI;TAKEUCHI TOSHIKIMI |
分类号 |
H05H1/24;C23C16/455;H01L21/205;H01L21/304;H01L21/3065 |
主分类号 |
H05H1/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|