Surface treatment electroplating or electroforming - where strip substrate is fed over fine jets of treatment liq

摘要

Device for undertaking a treatment- or prodn.- operation on at least one of the surface of a flexible strip substrate, using a treatment liq. The novelty is the use of a liq. feeder unit possessing a convex cylindrical surface (I) and contg. a liq. under pressure, surface (I) possessing numerous fine outlet holes in contact with the strip substrate, which is fed over surface (I) using longitudinal tension. The tension may be constant or adjusted to suit the pressure of the treatment liq. The continuous substrate may be a conductor or non-conductor, and may be used to form a deposit subsequently removed from the substrate and/or in electrochemical processes. Used e.g. for anodic oxidn. of al; pickling; electroplating of plastics or metals; or electroforming.