发明名称 GAS CONTROL IN PROCESS CHAMBER
摘要 A process chamber is provided including a sidewall, a substrate support, and an exhaust vent disposed above the substrate support. A processing region is formed between the exhaust vent and substrate support, and the exhaust vent is coupled to an exhaust device configured to create a low pressure at the exhaust vent relative to the processing region. The process chamber further includes a gas ring including an annular shaped body having an inner surface that circumscribes an annular region. The gas ring further includes a plurality of first nozzles that are coupled to a first gas source and configured to deliver a first gas to the processing region. The gas ring further includes a plurality of second nozzles that are coupled to a second gas source and configured to deliver a second gas to the processing region.
申请公布号 US2016369395(A1) 申请公布日期 2016.12.22
申请号 US201615184670 申请日期 2016.06.16
申请人 Applied Materials, Inc. 发明人 LIANG Qiwei;NEMANI Srinivas D.;YIEH Ellie Y.
分类号 C23C16/44;C23C16/455;C23C16/458 主分类号 C23C16/44
代理机构 代理人
主权项 1. A process chamber comprising: a sidewall; a substrate support; an exhaust vent disposed over the substrate support, wherein a processing region is formed between the exhaust vent and the substrate support, and the exhaust vent is coupled to an exhaust device configured to create a low pressure at the exhaust vent relative to the processing region; a gas ring comprising: an annular shaped body having an inner surface that circumscribes an annular region;a plurality of first nozzles that are coupled to a first gas source and configured to deliver a first gas to the processing region, wherein the plurality of first nozzles are formed in the annular shaped body in a first circular array; anda plurality of second nozzles that are coupled to a second gas source and configured to deliver a second gas to the processing region, wherein the plurality of second nozzles are formed in the annular shaped body in a second circular array.
地址 Santa Clara CA US