Assembly bonding

摘要

A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.

主权项

1. A method for manufacturing a device having an integrated circuit, comprising:
creating a plurality of chip contact pads on a chip by forming a first grid of metal lines on a surface of the chip, wherein the chip contact pads correspond to intersection points of the metal lines in the first grid; creating a plurality of substrate contact pads on a substrate by forming a second grid of metal lines on a surface of the substrate, wherein the substrate contact pads correspond to intersection points of the metal lines in the second grid and wherein the plurality of substrate contact pads correspond to the plurality of chip contact pads; applying assembly bonding material to each of the plurality of substrate contact pads formed on the substrate; and bonding the plurality of chip contact pads to the plurality of substrate contact pads via the assembly bonding material to bond the chip to the substrate.